2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (IEEE)
Off-Campus Access: Athens ID and Password Required
On-Campus Access: No User ID or Password Required
Mode of access: Internet
Keywords: Aerospace; Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics; Power, Energy and Industry Applications; Conference papers and proceedings