2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Opis bibliograficzny
Format: Elektroniczne Książka
Język:English
Wydane: IEEE
Hasła przedmiotowe:
Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics
Conference papers and proceedings.
Dostęp online:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

Internet

Full text available on IEEE [2017-2023]
Off-campus access

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