Advanced Flip Chip Packaging

Advanced Flip Chip Packaging

Dades bibliogràfiques
Altres autors:	Tong
Format:	Electrònic eBook
Idioma:	English
Publicat:	Springer US, 2013
Edició:	1
Matèries:	Electronic books
Accés en línia:	Full text available on Springer Off-campus access

Ítems similars

Fixing and Flipping Real Estate
per: Boardman
Publicat: (2013)

Flip Mino Pocket Guide, The
per: Breen

Laser Diode Chip and Packaging Technology

Simulating the transformation of plane triangulation using edge flip algorithms
per: Anushka, A fia Hossain, et al.
Publicat: (2022)

In quest of an improved algorithm for transforming plane triangulations by simultaneous flips
per: Prapty, Annesha Chowdhury, et al.
Publicat: (2023)

Flipped classroom: teaching and learning of English language in the context of EFL
per: Bohota, Nabila Israt
Publicat: (2019)

Advanced Packaging

Advanced Packaging

Advanced Packaging

Chip | Elsevier

Chip | Elsevier

Advanced Packaging Materials, International Symposium on

Microelectronic Yield, Reliability, and Advanced Packaging

Lab on a Chip

Chips | MDPI AG

Cool Chips, IEEE

BioChip Journal

Chips | MDPI AG

Proceedings of the 2013 Interconnection Network Architecture: On-Chip, Multi-Chip

Proceedings of the 2012 Interconnection Network Architecture: On-Chip, Multi-Chip Workshop

Chipped Stone Technological Organization
per: Johnson

Organs-on-a-Chip | Elsevier

Organs-on-a-Chip | Elsevier

A human silicon chip /
per: Chawla, Nishi
Publicat: (2003)

2018 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

2021 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

2020 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

Interconnection Network Architectures: On-Chip, Multi-Chip (INA-OCMC), International Workshop on

2015 Ninth International Workshop on Interconnection Network Architectures: On-Chip, Multi-Chip

2019 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

Proceedings of the Fifth International Workshop on Interconnection Network Architecture: On-Chip, Multi-Chip

Paperboard Packaging

Packaging Magazine

Paperboard Packaging

Optoelectronic Packaging

2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX)

2015 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XVIII)

Proceedings of the 8th International Workshop on Interconnection Network Architecture: On-Chip, Multi-Chip