Guidelines for Applying Cohesive Models to the Damage Behaviour of Engineering Materials and Structures
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| Materyal Türü: | Elektronik Ekitap |
| Dil: | English |
| Baskı/Yayın Bilgisi: |
Springer Berlin Heidelberg,
2013
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| Edisyon: | 1 |
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| Online Erişim: | Full text available on Springer Off-campus access |