Advanced Packaging

Advanced Packaging

Xehetasun bibliografikoak
Formatua:	Baliabide elektronikoa Aldizkaria
Hizkuntza:	English
Argitaratua:	Clarion Events, Inc
Sarrera elektronikoa:	Full text available on EBSCOhost[Apr 2003-Jan 2009] Off-campus access

Antzeko izenburuak

Advanced Packaging

Advanced Packaging

Advanced Flip Chip Packaging
Argitaratua: (2013)

Advanced Packaging Materials, International Symposium on

Microelectronic Yield, Reliability, and Advanced Packaging

Paperboard Packaging

Packaging Magazine

Paperboard Packaging

Optoelectronic Packaging

2019 Electrical Design of Advanced Packaging and Systems (EDAPS)

Advanced Packaging and Systems Symposium, EDAPS. Electrical Design of

2013 IEEE International Symposium on Advanced Packaging Materials

2011 International Symposium on Advanced Packaging Materials (APM)

2010 IEEE Electrical Design of Advanced Package & Systems Symposium

2010 International Symposium on Advanced Packaging Materials: Microtech (APM)

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

Popular Plastics & Packaging

Packaging for Food Preservation
nork: Del Nobile
Argitaratua: (2013)

Packaging Technology and Science

Nutrition learning packages /
Argitaratua: (1989)

Pharmaceutical packaging technology /
Argitaratua: (2000)

Packaging freedom : feminism and popular culture /
nork: Chanda, Ipsita
Argitaratua: (2003)

MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly

2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS)

2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

Software packages : 'O' Level. module-ii. section-B /
nork: Jain, V .K
Argitaratua: (1995)

Photonics Packaging and Integration VI

Components and Packaging for Laser Systems

Integration and Packaging of Optoelectronic Devices

Optoelectronic Interconnects and Packaging IV

Photonics Packaging and Integration IV

Photonics Packaging and Integration V