ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| フォーマット: | 電子媒体 雑誌 |
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| 言語: | English |
| 出版事項: |
ASME
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| オンライン･アクセス: | Full text available on ASME[2013-2013] Off-campus access |