2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP)

2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP)

Bibliographische Detailangaben
Format:	Elektronisch Buch
Sprache:	English
Veröffentlicht:	IEEE
Schlagworte:	Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Signal Processing and Analysis; Power, Energy and Industry Applications; Robotics and Control Systems Conference papers and proceedings.
Online Zugang:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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