2018 13th International Congress Molded Interconnect Devices (MID)

2018 13th International Congress Molded Interconnect Devices (MID)

Detalles Bibliográficos
Formato:	Electrónico Libro
Idioma:	English
Publicado:	IEEE
Subjects:	Aerospace; Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; General Topics for Engineers; Signal Processing and Analysis Conference papers and proceedings.
Acceso en liña:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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