2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Podrobná bibliografie
Médium:	Elektronický zdroj Kniha
Jazyk:	English
Vydáno:	IEEE
Témata:	Components, Circuits, Devices and Systems Conference papers and proceedings.
On-line přístup:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

Podobné jednotky

Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), International

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