2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Detalhes bibliográficos
Formato: Recurso Eletrônico Livro
Idioma:English
Publicado em: IEEE
Assuntos:
Components, Circuits, Devices and Systems; Robotics and Control Systems; Power, Energy and Industry Applications; Signal Processing and Analysis
Conference papers and proceedings.
Acesso em linha:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

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Full text available on IEEE [2017-2023]
Off-campus access

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