2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
| Formatua: | Baliabide elektronikoa Liburua |
|---|---|
| Hizkuntza: | English |
| Argitaratua: |
IEEE
|
| Gaiak: | |
| Sarrera elektronikoa: | Full text available on IEEE [2017-2023] Off-campus access |
| Classic Catalogue: | View this record in Classic Catalogue |
| Alearen deskribapena: | <strong>Off-Campus Access:</strong> Athens ID and Password Required <strong>On-Campus Access:</strong> No User ID or Password Required |
|---|---|
| Deskribapen fisikoa: | 1 online resource |
| Formatua: | Mode of access: Internet |
| ISBN: | 978-1-5386-6199-4 978-1-5386-6200-7 |
| Sartu: | Electronic access restricted to authorized BRAC University faculty, staff and students |