2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)

2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Библиографические подробности
Формат:	Электронный ресурс ‌
Язык:	English
Опубликовано:	IEEE
Предметы:	Components, Circuits, Devices and Systems; General Topics for Engineers; Power, Energy and Industry Applications; Robotics and Control Systems Conference papers and proceedings.
Online-ссылка:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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