Advanced Packaging Materials, International Symposium on

Advanced Packaging Materials, International Symposium on

Podrobná bibliografie
Médium: Elektronický zdroj Kniha
Jazyk:English
Vydáno: IEEE
Témata:
Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Fields, Waves and Electromagnetics; General Topics for Engineers; Photonics and Electrooptics
Conference papers and proceedings.
On-line přístup:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

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