2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

Dettagli Bibliografici
Natura:	Elettronico Libro
Lingua:	English
Pubblicazione:	IEEE
Soggetti:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; General Topics for Engineers Conference papers and proceedings.
Accesso online:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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