Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), International

Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), International

Podrobná bibliografie
Médium:	Elektronický zdroj Kniha
Jazyk:	English
Vydáno:	IEEE
Témata:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas Conference papers and proceedings.
On-line přístup:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

Podobné jednotky

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Electronic Packaging Technology, International Conference on (ICEPT)

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging

Electronics Packaging Technology Conference (EPTC)

2010 12th Electronics Packaging Technology Conference

2013 IEEE International Symposium on Advanced Packaging Materials

Wafer Level Packaging Conference (IWLPC), International

2016 11th International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM)

2020 13th International Conference on Advanced Semiconductor Devices And Microsystems (ASDAM)

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology

2018 International Wafer Level Packaging Conference (IWLPC)

Physical & Failure Analysis of Integrated Circuits, International Symposium on

Solid-State and Integrated Circuit Technology, International Conference on

Advanced Semiconductor Devices and Microsystems (ASDAM), International Conference on

The Eighth International Conference on Advanced Semiconductor Devices and Microsystems

Microelectronics and Packaging Conference, EMPC, European

IEEE Asian Solid-State Circuits Conference 2011

Solid-State Circuits (ASSCC), IEEE Asian Conference on,

2010 IEEE Asian Solid-State Circuits Conference

Compound Semiconductor Integrated Circuit (CSICS), IEEE Symposium on

18th European Microelectronics & Packaging Conference

2010 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2013 Symposium on VLSI Circuits

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)