2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration

التفاصيل البيبلوغرافية
التنسيق:	الكتروني كتاب
اللغة:	English
منشور في:	IEEE
الموضوعات:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; General Topics for Engineers; Computing and Processing Conference papers and proceedings.
الوصول للمادة أونلاين:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

مواد مشابهة

Low Temperature Bonding for 3D Integration (LTB-3D), IEEE International Workshop on

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