2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Dettagli Bibliografici
Natura:	Elettronico Libro
Lingua:	English
Pubblicazione:	IEEE
Soggetti:	Components, Circuits, Devices and Systems Conference papers and proceedings.
Accesso online:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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