2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)

2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)

Bibliographische Detailangaben
Format:	Elektronisch Buch
Sprache:	English
Veröffentlicht:	IEEE
Schlagworte:	Components, Circuits, Devices and Systems; General Topics for Engineers; Photonics and Electrooptics; Power, Energy and Industry Applications; Robotics and Control Systems Conference papers and proceedings.
Online Zugang:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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